sep - semiconductor enhanced products

We offer a wide band of services that enhance the use of semiconductors. Enhancement services include problem-solving engineering and manufacturing for both low and high volume assembly. We refer to our wide variety of products and services as Semiconductor Enhancement Products.

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IC packages Design and manufacturing of a broad line of high lead count IC packages utilizing printed circuit board interconnects, unique molding capabilities and thermal management solutions.
Chip Modules We can help you improve performance and lower cost through design solutions by isolating high performance components on high count multi-layer PCB’s that then connect to lower layer count
Footprint Conversion Adapters

We have produced more than 1,000 adapters that convert one semiconductor form factor to another. Examples: BGA to PGA, BGA to QFP, BGA to BGA, QFP to BGA, SMT to DIP, SMT to SMT, PGA to PGA.

Chip on Board /
Chip on Flex

 Flexible circuit technology is used in discrete packages for improved circuit density. Through the use of unique assembly processes, we can reduce the size and cost of complex circuitry.